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对金属、橡胶、玻璃、陶瓷、塑料、木材、织物、皮革等多种材料都有优良的胶粘性能。
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环氧树脂导热胶粘剂,具有结构功能胶的特性,导热效果好,粘接性好,对铝、铜、不锈钢等多种材料都具有较好的粘接性,耐热性能好。
应用于散热模组、交通工具、电工电气、新型能源、家用电器如空调和热水器、工控计算机、锂电池等领域。
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单组分,加热快速固化,固化后具有极高的粘结强度与机械强度、优异的耐温、耐化学性能。
可用于电子产品零部件及结构件的粘结固定、密封防护、器件保护等。
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单组分的间隙填充导热材料,随结构形状成型,具备优异的结构适用性和结构件表面贴服特性,缝隙填充充分。具有良好的绝缘耐压特性和温度稳定性,安全、可靠。
应用于散热器底部或框架,高速硬盘驱动器,微型热管散热器,汽车发动机控制装置,半导体自动试验设备。广泛适用于通信设备如网络终端、存储设备,LED显示屏背光管,消费电子电源器件、安防设备、仪器仪表、电工电气、汽车电子等行业领域。
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有机硅导热灌封胶,可室温固化,也可以加热加速固化。
适用于电子产品如电源模块、新能源汽车电控模块、氢燃料电池高功率控制模块。
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有机硅导热胶粘剂,具有良好电绝缘和抗电弧性能,可在-50℃~200℃温度范围内长期使用,贮存稳定优。
可粘接常见的金属和非金属材料,应用于多种金属之间、金属和非金属材料之间的设备发热、受热部件粘合、密封。 适用于发热元器件与散热器之间的粘接与密封,发热元器件的固定粘接。
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半流淌耐温型有机硅粘接密封胶,具有优异的耐温性,使用温度范围-50℃~200℃,还具有良好的密封粘接性能。
广泛用于电子元器件的固定补强、腔体密封、防水保护等,也适用于高温应用中的密封、填充、粘合、封装,如高温厨电、电熨斗、空气净化器。
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紫外光固化、丙烯酸酯胶粘剂,附着力好、坚韧、耐候性好。多种不同粘度、硬度、颜色选择,施胶方便,快速固化,提升装配效率。
针对结构粘接、电子排线补强、电子元器件固定密封而设计。
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线路板涂覆三防胶,在丙烯酸脂配方中加入光引发剂,吸收紫外线产生活性自由基引发固化。固化后会形成一层柔韧的薄膜,可有效地隔离并可保护电路免遭化学品、潮湿和其它污物的侵蚀,提高线路板的可靠性。
适用于PCB电路保护,提高线路板的可靠性。
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聚氨酯共形覆膜三防漆,不含苯类、丁酮等有害溶剂,用于线路板的防潮、防尘、 防静电等披敷防护。
可广泛应用于家用电器、通讯设备、工控设备、汽车电子、电动工具、新能源等电子电器产品的线路板保护。
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是一种湿气反应型固化聚氨酯热熔胶,其粘接性和韧性都可调节,并有着优异的粘接强度,耐温性、耐化学腐蚀性佳。
主要用于智能手机、平板、手表TP与外壳粘接;智能穿戴如手环、VR设备的边框及部件粘接;家电的控制面板粘接;汽车车灯、FPC固定粘接。
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以经济+便捷的胶粘材料应用方案,应对新能源汽车的各种挑战,实现轻量化、高效化的制造装配需求。
动力电池模组的粘接、导热、密封等核心需求,是不断发展和革新的新材料的关键应用所在,通过材料技术和胶水配方的不断优化,Ancham面向更轻量化的汽车制造需求,提出更实用的新能源汽车胶粘解决方案。
环氧系列产品可以有效传导动力电池的过高温度,不同功用的产品还可以为电子器件提供高性能的导电方案。
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针对TWS耳机的材料需求,安川新材提供结构粘接、防水与密封产品,为制造商提供更加轻质耐用的胶粘产品应用方案。
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聚氨酯绝缘灌封胶 ,加热快速固化。有出色的耐化学性,低温下有优异的柔韧性,适用对应力敏感的电子元器件封装保护,对塑料、金属和玻璃具有出色的附着力,有低且稳定的介电常数。
■ 汽车传感器、车身电子ECU、车载电子装置元器件的密封; ■ 通讯设备的天线、信号接发装置灌封; ■ 消费电子电器中,对应力敏感的芯片或磁性元件的保护。
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双组分环氧导热灌封胶,可在室温或者加热条件下固化,具有良好的导热性能,以及出色的绝缘性能,粘度低,流动性好,能满足小间隙灌封应用。
适用于精密电子产品的封装保护应用。
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有机硅共形覆膜三防漆,低气味,优异电绝缘性,耐温性,含荧光检测,可厚层涂敷,可室温固化,或者加热快速固化,满足HF,ROHS,UL94-V0阻燃。
可广泛应用于家用电器、通讯设备、工控设备、汽车电子、电动工具、新能源等电子电器类产品PCB集成电路板的三防保护应用。
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智能穿戴的生产工艺流程中,胶粘剂的应用集中于制板焊接、封装, 组件装配环节,提供粘接固定、密封的作用。
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新能源汽车的核心是三电系统,即电池、电驱、电控,安川的技术和产品针对三电系统中多个部件或模组的生产、组装工艺,提供导热和密封等功能性应用。如电池粘接和封装、BMS电池管理系统模块的封装、OBC/DC-DC车载充电部件的导热和封装。
Product Model | Color | More Parameters |
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Product Model | Color | No dataMore Parameters | ||||||
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AE22(07) | Black | 5:1 | 2500±500 25℃ | 85±5D | 3~5h Initial Curing Time 24h Complete Curing Time | 0.7W/m·K | Detailed introduction | |
AE22(10) | Black | 10:1 | 4000±1000 25℃ | 85±5D | 3~5h Initial Curing Time 24h Complete Curing Time | 1.0W/m·K | Detailed introduction | |
AE1205 | Grey | Paste | 88±3D | 60min/130°C 30min/150°C | -40~150℃ | 12MPa Steel (grit blasted) | 5.0W/m·K | Detailed introduction |
AE1101 | Black/Grey/White | 35000±5000 25℃ | 83±3D | 4~5min 80℃ | -40~150℃ | ≥20MPa Steel (grit blasted) |
Detailed introduction | |
AE1102 | Black/Grey/White | 30000±5000 25℃ | 80±5D | 5~6min 80℃ | -40~150℃ | ≥16MPa Steel (grit blasted) ≥10MPa(PA) |
Detailed introduction | |
AE1106 | Black/Grey/White | 20000±5000 25℃ | 85±5D | 30min 60℃ | -40~150℃ | 20MPa Steel (grit blasted) |
Detailed introduction | |
AE1107 | Black | 70000±10000 25℃ | 85±5D | 12~15min 80℃ | -40~180℃ | 24MPa Steel (grit blasted) |
Detailed introduction | |
AE1112 | Black | 70000±10000 25℃ | 85±5D | 30min 80℃ | -40~180℃ | 22MPa Steel (grit blasted) |
Detailed introduction | |
AE1151 | Black/Grey | 65000±15000 25℃ | 88±3D | 60min 100℃ | -40~200℃ | 20MPa Steel (grit blasted) |
Detailed introduction | |
AE1155 | Black | 125000±15000 25℃ | 88±3D | 22~25min 100℃ | -40~200℃ | 25MPa Steel (grit blasted) |
Detailed introduction | |
AE1171 | Light gray white | Paste | 88±3D | 30~40min 120℃ | -40~180℃ | 34MPa Steel (grit blasted) |
Detailed introduction | |
AE2110 | Black/Off-white | 12500±2500 25℃ | 80±5D | 10~20min Initial Curing Time 24h Complete Curing Time | -40~120℃ | 17MPa Steel (grit blasted) |
Detailed introduction | |
AE1308 | Black | 25000±2500 25℃ | 85±5D | 5~6min 80℃ | -40~150℃ | ≥17MPa Steel (grit blasted) |
Detailed introduction |
Product Model | Color | No dataMore Parameters | |||||||
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AS3101 | Black/White | 5000~10000 25℃ | 65±5A | 168h 25℃/60%RH | 3.56×10^13Ω.cm | -40~90℃ | Detailed introduction | ||
AS32(03) | White | N/A | 250000±50000 25℃ | 60±5 Shore 00 | 20~30min 100℃ | -50~200℃ | 3.1W/m·K | Detailed introduction | |
AS42(00) | Light grey | 1:1 | 6000±1000 25℃ | 65±10 Shore 00 | 4~6h Initial Curing Time 24~48h Complete Curing Time | -50~200℃ | 2.5W/m·K | Detailed introduction | |
AS42(15) | Grey | 1:1 | 5000±1000 25℃ | 45±5A | 3~5h Initial Curing Time 24h Complete Curing Time | -40~200℃ | 1.5W/m·K | Detailed introduction | |
AS42(16) | Grey | 1:1 | 3000±1000 25℃ | 65±10 Shore 00 | 4~6h Initial Curing Time 24~48h Complete Curing Time | -50~200℃ | 1.6W/m·K | Detailed introduction | |
AS42(20) | Light gray | 1:1 | 9500±1000 25℃ | 45±5A | 4~6h Initial Curing Time 24h Complete Curing Time | -50~200℃ | 2.0W/m·K | Detailed introduction | |
AS42(35) | Pink | 1:1 | 12500±2500 25℃ | 25±5A | 3~5h Initial Curing Time 24h Complete Curing Time | -50~200℃ | 3.8W/m·K | Detailed introduction | |
AS35(50) | Transparent/ Translucent (fluorescent) |
500±100 25℃ | 0-level | 20kV/mm | 3.0×10^15Ω.cm | -50~200℃ | Detailed introduction | ||
AS42(02) | Light grey | 1:1 | Paste | 50±10 Shore 00 | 24~48h/25℃ 20~30min/80℃ | -50~200℃ | 2.0W/m·K | Detailed introduction | |
AS42(04) | Khaki | 1:1 | Paste | 60±10 Shore 00 | 24~48h/25℃ 20~30min/80℃ | -50~200℃ | 4.0W/m·K | Detailed introduction | |
AS32(15) | Grey/White | Paste | 70±5A | 2~6min 25℃/60%RH | 3.1MPa | -50~200℃ | 2~3MPa Aluminium/Aluminium | 1.55W/m·K | Detailed introduction |
AS32(25) | White | Paste | 62±3A | 2~5min 25℃/60%RH | 1.5MPa | -50~200℃ | 1.5~2MPa Aluminium/Aluminium | 2.75W/m·K | Detailed introduction |
AS32(06) | White | Paste | 60±3A | 3~15min 25℃/60%RH | >20% | -50~200℃ | 2.0MPa Aluminium/Aluminium |
Detailed introduction | |
AS32(07) | White | Paste | 55±3A | 2~8min 25℃/60%RH | >50% | -50~200℃ | 1.5~2MPa Aluminium/Aluminium |
Detailed introduction | |
AS3401 | Black/White | 5000~10000 25℃ | 30±5A | 3~15min 25℃/60%RH | ≥120% | -50~200℃ | 2.1MPa Aluminium/Aluminium |
Detailed introduction | |
AS3403 | Black/White | 25000±5000 25℃ | 30±5A | 5~15min 25℃/60%RH | ≥100% | -50~200℃ | 2.5MPa Aluminium/Aluminium |
Detailed introduction | |
AS3406 | Black/White | 60000±10000 25℃ | 30±5A | 3~15min 25℃/60%RH | ≥100% | -50~200℃ | 1.95MPa Aluminium/Aluminium |
Detailed introduction | |
AS3407 | Transparent/ Translucent | 75000±15000 25℃ | 28±3A | 5~20min 25℃/60%RH | ≥120% | -50~200℃ | 3~4MPa Aluminium/Aluminium |
Detailed introduction | |
AS3445 | Black/White | Paste | 45±5A | 5~20min 25℃/60%RH | ≥400% | -50~200℃ | 2.5MPa Aluminium/Aluminium |
Detailed introduction | |
AS3461 | Black/Off-white | 5000~10000 25℃ | 30±5A | 10~25min 25℃/60%RH | ≥120% | -50~200℃ | 1.5~2.3MPa Aluminium/Aluminium |
Detailed introduction | |
AS3465 | Black/White | Paste | 38±3A | 168h 25℃/60%RH | ≥600% | -50~200℃ | 2.5MPa Aluminium/Aluminium |
Detailed introduction | |
AS3483 | Black/White | 30000±5000 25℃ | 25±3A | 5~20min 25℃/60%RH | 150% | -40~200℃ | 1.5~2.0MPa Aluminium/Aluminium |
Detailed introduction |
Product Model | Color | No dataMore Parameters | |||||
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AC55(30) | Transparent/Translucent (fluorescent) | 300±150 25℃ | 0-level | >14kV/mm | >2.1x10^12 Ω.cm | -40~125℃ | Detailed introduction |
AC55(60) | Transparent/Translucent (fluorescent) | 650±150 25℃ | 0-level | >14kV/mm | >2.1x10^12 Ω.cm | -40~125℃ | Detailed introduction |
AC5105 | Transparent/Blue/Red | 5000±500 25℃ | 55±5D | 1000~5000mJ/cm² | >12MPa PC/PC |
Detailed introduction | |
AC5108 | Light blue transparent/colorless transparent | 8500±1000 25℃ | 55±5D | 1000~3000mJ/cm² | ≥12MPa PC/PC |
Detailed introduction | |
AC5120 | Transparent | 20000 25℃ | 65±5D | 30mW/cm² | 11MPa PC/PC |
Detailed introduction | |
AC5415 | Transparent/Blue/Red | 20000±5000 25℃ | 45±5D | 1000~5000mJ/cm² | 5~6.5MPa PC/PC |
Detailed introduction | |
AC5433 | Transparent/Blue/Red | 22000±5000 25℃ | 70±5D | 800mJ/cm² | ≥8MPa PC/PC |
Detailed introduction | |
AC5445 | Translucent | 45000±10000 25℃ | 30±5A | 2000-3000mJ/cm² | 4.5MPa PC/PC |
Detailed introduction | |
AC5602 | White | 25000±5000 25℃ | 70±5D | 2000~5000mJ/cm² | 7~9MPa PC/PC |
Detailed introduction | |
AC5615F | Clear yellowish/Red/Blue (fluorescent) | 15000±2000 25℃ | 68±5D | 2000mJ/cm² | ≥18MPa PC/PC |
Detailed introduction |
Product Model | Color | No dataMore Parameters | ||||||
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AP83(35) | Black | 100:16 | 1100±300 25℃ | 30~40min 25℃ | 4.5MPa | >20kV/mm | -55~130℃ | Detailed introduction |
AP83(55) | Black | 100:16 | 1100±300 25℃ | 30~40min 25℃ | 7.5MPa | >20kV/mm | -40~130℃ | Detailed introduction |
AP8108 | Black | 1:1 | 45000±10000 25℃ | 65±3D | -40~85℃ | 9MPa Aluminium/Aluminium | 0.8W/m·K | Detailed introduction |
AP8112 | Black | 1:1 | 45000±10000 25℃ | 70±3D | -40~100℃ | 10MPa Aluminium/Aluminium | 1.2W/m·K | Detailed introduction |
AP9502 | Amber transparent (fluorescent) | 12~25S 4mm-cup/25℃ | 1-level | 38~42% | 2.0x10^15 Ω.cm | -40~134℃ | Detailed introduction | |
AP9502HV | Yellowish to light brown/Transparent | 65~80S 4mm-cup/23℃ | 1-level | 43~48% | 2.0x10^15 Ω.cm | -40~134℃ | Detailed introduction | |
AP9101 | Clear yellowish/ Black | 4000~6000 100℃ | 80±5A | 2~4min 25℃ | 1350% | 10~12MPa PC/PC |
Detailed introduction | |
AP9131 | Clear yellowish/ Black /Silvery | 5000~7000 100℃ | 75±5A | 2~4min 25℃ | ≥650% | 9~11MPa PC/PC |
Detailed introduction | |
AP9161 | Clear yellowish/ Black | 5000~7000 100℃ | 75±5A | 3~5min 25℃ | ≥700% | 10~12MPa PC/PC |
Detailed introduction | |
AP9165 | Clear yellowish/ Black | 5000~7000 100℃ | 75±5A | 3~5min 25℃ | ≥800% | ≥10MPa PC/PC |
Detailed introduction | |
AP9166 | Clear yellowish/ Black | 5000~7000 100℃ | 80±5A | 3~5min 25℃ | ≥650% | 11~13MPa PC/PC |
Detailed introduction |
Thermally conductive epoxy adhesive, with both characteristics of structural and thermal conductive bonding. Good adhesion to metal substrates such as aluminum, copper, stainless steel and so on, as well excellent high temperature resistance.
Applied in heat dissipation module, transportation, electrical appliances, new energy, household appliances such as air conditioning and water heaters, industrial control computes, lithium batteries and other fields.
Product Model | Color | Viscosity | Hardness | Condition | Temperature | Lap Shear Strength | Thermal Conductivity | More Parameters |
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AE1205 | Grey | Paste | 88±3D | 60min/130°C 30min/150°C | -40~150℃ | 12MPa Steel (grit blasted) | 5.0W/m·K | Detailed introduction |
One-component, fast curing by heating, with extremely high bonding strength and mechanical strength, excellent temperature resistance, chemical resistance.
Used for bonding and fixing, sealing protection, device protection, etc. of electronic product parts and structural parts.
Product Model | Color | Viscosity | Hardness | Condition | Temperature | Lap Shear Strength | More Parameters |
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AE1101 | Black/Grey/White | 35000±5000 25℃ | 83±3D | 4~5min 80℃ | -40~150℃ | ≥20MPa Steel (grit blasted) |
Detailed introduction |
AE1102 | Black/Grey/White | 30000±5000 25℃ | 80±5D | 5~6min 80℃ | -40~150℃ | ≥16MPa Steel (grit blasted) ≥10MPa(PA) |
Detailed introduction |
AE1106 | Black/Grey/White | 20000±5000 25℃ | 85±5D | 30min 60℃ | -40~150℃ | 20MPa Steel (grit blasted) |
Detailed introduction |
AE1107 | Black | 70000±10000 25℃ | 85±5D | 12~15min 80℃ | -40~180℃ | 24MPa Steel (grit blasted) |
Detailed introduction |
AE1112 | Black | 70000±10000 25℃ | 85±5D | 30min 80℃ | -40~180℃ | 22MPa Steel (grit blasted) |
Detailed introduction |
AE1151 | Black/Grey | 65000±15000 25℃ | 88±3D | 60min 100℃ | -40~200℃ | 20MPa Steel (grit blasted) |
Detailed introduction |
AE1155 | Black | 125000±15000 25℃ | 88±3D | 22~25min 100℃ | -40~200℃ | 25MPa Steel (grit blasted) |
Detailed introduction |
AE1171 | Light gray white | Paste | 88±3D | 30~40min 120℃ | -40~180℃ | 34MPa Steel (grit blasted) |
Detailed introduction |
AE2110 | Black/Off-white | 12500±2500 25℃ | 80±5D | 10~20min Initial Curing Time 24h Complete Curing Time | -40~120℃ | 17MPa Steel (grit blasted) |
Detailed introduction |
AE1308 | Black | 25000±2500 25℃ | 85±5D | 5~6min 80℃ | -40~150℃ | ≥17MPa Steel (grit blasted) |
Detailed introduction |
Thermally conductive silicone gap filler, formed with the shape of the structure, with excellent structural applicability and surface conformability characteristics of structural parts, and sufficient gap filling. With good insulation withstand voltage characteristics and temperature stability, safe and reliable.
Applied to the heat sink bottom or frame, high speed hard drive, micro heat pipe heat sink, automotive engine control device, semiconductor automatic testing equipment. Widely used in telecommunication equipment such as network terminal, storage equipment, LED display backlight tube, consumer electronics power devices, security equipment, instruments, electrical, automotive electronics and other industries.
Product Model | Color | Mixing Ratio | Viscosity | Hardness | Condition | Temperature | Thermal Conductivity | More Parameters |
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AS32(03) | White | N/A | 250000±50000 25℃ | 60±5 Shore 00 | 20~30min 100℃ | -50~200℃ | 3.1W/m·K | Detailed introduction |
AS42(02) | Light grey | 1:1 | Paste | 50±10 Shore 00 | 24~48h/25℃ 20~30min/80℃ | -50~200℃ | 2.0W/m·K | Detailed introduction |
AS42(04) | Khaki | 1:1 | Paste | 60±10 Shore 00 | 24~48h/25℃ 20~30min/80℃ | -50~200℃ | 4.0W/m·K | Detailed introduction |
Thermally conductive silicone potting compound, curing at room temperature, and fast curing by the heating.
suitable for electronic products such as power supply module, control units in electric vehicle, high power control modules in hydrogen fuel cell.
Product Model | Color | Mixing Ratio | Viscosity | Hardness | Condition | Temperature | Thermal Conductivity | More Parameters |
---|---|---|---|---|---|---|---|---|
AS42(00) | Light grey | 1:1 | 6000±1000 25℃ | 65±10 Shore 00 | 4~6h Initial Curing Time 24~48h Complete Curing Time | -50~200℃ | 2.5W/m·K | Detailed introduction |
AS42(15) | Grey | 1:1 | 5000±1000 25℃ | 45±5A | 3~5h Initial Curing Time 24h Complete Curing Time | -40~200℃ | 1.5W/m·K | Detailed introduction |
AS42(16) | Grey | 1:1 | 3000±1000 25℃ | 65±10 Shore 00 | 4~6h Initial Curing Time 24~48h Complete Curing Time | -50~200℃ | 1.6W/m·K | Detailed introduction |
AS42(20) | Light gray | 1:1 | 9500±1000 25℃ | 45±5A | 4~6h Initial Curing Time 24h Complete Curing Time | -50~200℃ | 2.0W/m·K | Detailed introduction |
AS42(35) | Pink | 1:1 | 12500±2500 25℃ | 25±5A | 3~5h Initial Curing Time 24h Complete Curing Time | -50~200℃ | 3.8W/m·K | Detailed introduction |
Thermally conductive silicone adhesive, with good electrical insulation and arc resistance performance, can be used in-50℃~200℃ temperature range, very stable for the storage.
Bonding with normal metals and non-metallic materials, suitable for bonding and sealing between heating components and heat sinks, and fixing bonding of heating components .
Product Model | Color | Viscosity | Hardness | Tack Free Time | Tensile Strength | Temperature | Lap Shear Strength | Thermal Conductivity | More Parameters |
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AS32(15) | Grey/White | Paste | 70±5A | 2~6min 25℃/60%RH | 3.1MPa | -50~200℃ | 2~3MPa Aluminium/Aluminium | 1.55W/m·K | Detailed introduction |
AS32(25) | White | Paste | 62±3A | 2~5min 25℃/60%RH | 1.5MPa | -50~200℃ | 1.5~2MPa Aluminium/Aluminium | 2.75W/m·K | Detailed introduction |
Semi-flowing, RTV silicone adhesive sealant, with excellent temperature resistance, working temperature range -50~200℃, but also has good sealing bonding performance.
Widely used in electronic components of fixed reinforcement, cavity sealing, waterproof protection, etc., but also suitable for high temperature applications in sealing, filling, adhesion, packaging, such as high temperature kitchen electricity, electric iron, air purifier.
Product Model | Color | Viscosity | Hardness | Tack Free Time | Fracture Elongation | Temperature | Lap Shear Strength | More Parameters |
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AS32(06) | White | Paste | 60±3A | 3~15min 25℃/60%RH | >20% | -50~200℃ | 2.0MPa Aluminium/Aluminium |
Detailed introduction |
AS32(07) | White | Paste | 55±3A | 2~8min 25℃/60%RH | >50% | -50~200℃ | 1.5~2MPa Aluminium/Aluminium |
Detailed introduction |
AS3401 | Black/White | 5000~10000 25℃ | 30±5A | 3~15min 25℃/60%RH | ≥120% | -50~200℃ | 2.1MPa Aluminium/Aluminium |
Detailed introduction |
AS3403 | Black/White | 25000±5000 25℃ | 30±5A | 5~15min 25℃/60%RH | ≥100% | -50~200℃ | 2.5MPa Aluminium/Aluminium |
Detailed introduction |
AS3406 | Black/White | 60000±10000 25℃ | 30±5A | 3~15min 25℃/60%RH | ≥100% | -50~200℃ | 1.95MPa Aluminium/Aluminium |
Detailed introduction |
AS3407 | Transparent/ Translucent | 75000±15000 25℃ | 28±3A | 5~20min 25℃/60%RH | ≥120% | -50~200℃ | 3~4MPa Aluminium/Aluminium |
Detailed introduction |
AS3445 | Black/White | Paste | 45±5A | 5~20min 25℃/60%RH | ≥400% | -50~200℃ | 2.5MPa Aluminium/Aluminium |
Detailed introduction |
AS3461 | Black/Off-white | 5000~10000 25℃ | 30±5A | 10~25min 25℃/60%RH | ≥120% | -50~200℃ | 1.5~2.3MPa Aluminium/Aluminium |
Detailed introduction |
AS3465 | Black/White | Paste | 38±3A | 168h 25℃/60%RH | ≥600% | -50~200℃ | 2.5MPa Aluminium/Aluminium |
Detailed introduction |
AS3483 | Black/White | 30000±5000 25℃ | 25±3A | 5~20min 25℃/60%RH | 150% | -40~200℃ | 1.5~2.0MPa Aluminium/Aluminium |
Detailed introduction |
UV curing, acrylate adhesive, designed for structure bonding, electronic wiring reinforcement, electronic fixed sealing components. It has the characteristics of good adhesion, toughness and good environment resistance. A variety of different viscosity, hardness, color selection, easy to apply, fast curing, improve the assembly efficiency.
For fast curing preformed products for temporary protection, shielding in the process, suitable for bonding large area of plastic and metal surfaces.
Product Model | Color | Viscosity | Hardness | Condition | Lap Shear Strength | More Parameters |
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AC5105 | Transparent/Blue/Red | 5000±500 25℃ | 55±5D | 1000~5000mJ/cm² | >12MPa PC/PC |
Detailed introduction |
AC5108 | Light blue transparent/colorless transparent | 8500±1000 25℃ | 55±5D | 1000~3000mJ/cm² | ≥12MPa PC/PC |
Detailed introduction |
AC5415 | Transparent/Blue/Red | 20000±5000 25℃ | 45±5D | 1000~5000mJ/cm² | 5~6.5MPa PC/PC |
Detailed introduction |
AC5433 | Transparent/Blue/Red | 22000±5000 25℃ | 70±5D | 800mJ/cm² | ≥8MPa PC/PC |
Detailed introduction |
AC5445 | Translucent | 45000±10000 25℃ | 30±5A | 2000-3000mJ/cm² | 4.5MPa PC/PC |
Detailed introduction |
The coating for circuit board, and a photo-initiator is added to the acrylic formula, which absorbs ultraviolet rays to produce active free radicals to trigger curing. Curing forms a flexible film that effectively isolates and protects circuits from chemicals, moisture and other contaminants, improving the reliability of the circuit board.
Protection for PCB circuit, improve the reliability of the circuit board.
Product Model | Color | Viscosity | Adhesion | Dielectric Strength | Volume Resistivity | Temperature | More Parameters |
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AC55(30) | Transparent/Translucent (fluorescent) | 300±150 25℃ | 0-level | >14kV/mm | >2.1x10^12 Ω.cm | -40~125℃ | Detailed introduction |
AC55(60) | Transparent/Translucent (fluorescent) | 650±150 25℃ | 0-level | >14kV/mm | >2.1x10^12 Ω.cm | -40~125℃ | Detailed introduction |
Thermally conductive polyurethane adhesive has excellent thermal conductivity and flame retardancy, low shrinkage after curing, resistance to mechanical vibration, cold and hot impact, and excellent resistance to high temperature and humidity environments.
■ Quick curing, low shrinkage. ■ Good low-temperature toughness, high temperature and humidity resistance, and excellent environmental performance. ■ Suitable for various substrates, with high adhesive strength. ■ Flame retardant in accordance with UL94-V0. ■ Comply with RoHS and Reach.
Product Model | Color | Mixing Ratio | Viscosity | Hardness | Temperature | Lap Shear Strength | Thermal Conductivity | More Parameters |
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AP8108 | Black | 1:1 | 45000±10000 25℃ | 65±3D | -40~85℃ | 9MPa Aluminium/Aluminium | 0.8W/m·K | Detailed introduction |
AP8112 | Black | 1:1 | 45000±10000 25℃ | 70±3D | -40~100℃ | 10MPa Aluminium/Aluminium | 1.2W/m·K | Detailed introduction |
Polyurethane conformal coating, excluding benzene, butanone and other harmful solvents, used for the circuit board moisture-proof, dustproof, anti-static protection and so on.
Widely used for circuit board protection in household appliances, telecommunication equipment, industrial control devices, automotive electronics, electrical power tools, new energy and so on.
Product Model | Color | Viscosity | Adhesion | Solid content | Volume Resistivity | Temperature | More Parameters |
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AP9502 | Amber transparent (fluorescent) | 12~25S 4mm-cup/25℃ | 1-level | 38~42% | 2.0x10^15 Ω.cm | -40~134℃ | Detailed introduction |
AP9502HV | Yellowish to light brown/Transparent | 65~80S 4mm-cup/23℃ | 1-level | 43~48% | 2.0x10^15 Ω.cm | -40~134℃ | Detailed introduction |
Moisture curing polyurethane hot melt adhesive, the adhesion and toughness can be adjusted, with excellent bonding strength, temperature resistance, chemical corrosion resistance.
Mainly applied for smart phones, tablet, smart watch TP and frame bonding, wearable devices such as bracelet and VR devices, control panel bonding of home appliances, vehicle lighting, FPC fixed bonding.
Product Model | Color | Viscosity | Hardness | Open Time | Fracture Elongation | Lap Shear Strength | More Parameters |
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AP9101 | Clear yellowish/ Black | 4000~6000 100℃ | 80±5A | 2~4min 25℃ | 1350% | 10~12MPa PC/PC |
Detailed introduction |
AP9131 | Clear yellowish/ Black /Silvery | 5000~7000 100℃ | 75±5A | 2~4min 25℃ | ≥650% | 9~11MPa PC/PC |
Detailed introduction |
AP9161 | Clear yellowish/ Black | 5000~7000 100℃ | 75±5A | 3~5min 25℃ | ≥700% | 10~12MPa PC/PC |
Detailed introduction |
AP9165 | Clear yellowish/ Black | 5000~7000 100℃ | 75±5A | 3~5min 25℃ | ≥800% | ≥10MPa PC/PC |
Detailed introduction |
AP9166 | Clear yellowish/ Black | 5000~7000 100℃ | 80±5A | 3~5min 25℃ | ≥650% | 11~13MPa PC/PC |
Detailed introduction |
Two-component thermal conductive epoxy potting, which can cure at room temperature or heating conditions, has good thermal conductivity and excellent insulation performance, low viscosity, good fluidity, and can meet small gap sealing applications.
Suitable for packaging and protection applications of precision electronic products.
Product Model | Color | Mixing Ratio | Viscosity | Hardness | Condition | Thermal Conductivity | More Parameters |
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AE22(07) | Black | 5:1 | 2500±500 25℃ | 85±5D | 3~5h Initial Curing Time 24h Complete Curing Time | 0.7W/m·K | Detailed introduction |
AE22(10) | Black | 10:1 | 4000±1000 25℃ | 85±5D | 3~5h Initial Curing Time 24h Complete Curing Time | 1.0W/m·K | Detailed introduction |
Silicone conformal coating, good insulation and temperature resistance. It can be detected by fluorescence and meet the flame retardant standards of HF, RoHS and ul94-v0.
Suitable for electronic products such as power supply module, new energy vehicle electric control module, hydrogen fuel cell high power control module.
Product Model | Color | Viscosity | Adhesion | Dielectric Strength | Volume Resistivity | Temperature | More Parameters |
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AS35(50) | Transparent/ Translucent (fluorescent) |
500±100 25℃ | 0-level | 20kV/mm | 3.0×10^15Ω.cm | -50~200℃ | Detailed introduction |
Relying on leading solutions, we can manufacture "reliable + durable" innovative products, explore the problems of accelerating the efficiency and benefits of adhesive application in electronic manufacturing industry, and help build a new future of adhesive industry.
The core requirements of power batteries (such as bonding, heat dissipation and sealing) are the key applications of new materials. By optimizing technology and formula, we provide product solutions for lighter and safer automobile manufacturing. Epoxy adhesive can conduct the temperature of power battery, and organic silica gel adhesive can provide high-performance heat conduction scheme for electronic devices.
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Relying on leading solutions, we can manufacture "reliable + durable" innovative products, explore the problems of accelerating the efficiency and benefits of adhesive application in electronic manufacturing industry, and help build a new future of adhesive industry.
With the development of technology, the functions and forms of intelligent hardware are becoming more and more diverse. The special properties of adhesives help intelligent hardware achieve the adhesion of complex structures, playing an important role in both assembly and maintenance of hardware equipment.
Provide strong support for the innovative research and development of intelligent hardware manufacturers.
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From board-level cloak protection to electrical performance management and thermal management, continuous application exploration has enabled Ancham to accumulate rich experience in the innovative research and development of high-performance adhesives.
Derived from our original vision of safe and easy-to-use technology, Ancham offers a flexible and comprehensive product portfolio for ADAS advanced driver assistance systems. For single, dual and surround view cameras, millimeter wave and LiDAR, Ancham products provide reliable and convenient solutions in bonding, sealing, protection and thermal management, making the cooperative work of multiple sensors more flexible and reliable.
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Ancham offers structural bonding, waterproofing and sealing products to meet the material needs of TWS headsets, providing manufacturers with lighter and more durable adhesive product applications
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In the production process of smart watches, the application of adhesives is concentrated in the process of board welding, packaging and assembly of components, providing the role of bonding and sealing.
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The core of new energy vehicles is the tri-electric system, i.e., battery, electric drive, and electric control. Ancham's technologies and products provide functional applications such as thermal conductivity and sealing for the production and assembly process of multiple parts or modules in the tri-electric system. For example, battery bonding and packaging, BMS battery management system module packaging, and OBC/DC-DC vehicle charging component thermal conductivity and packaging.
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依托行业领先的智能家居解决方案,实现“可靠+耐用”的创新应用组合,同时探索加快电子制造行业的应用效率和效益问题,助力构建电子材料行业的新未来。
物联网让传统家具变得更加聪明,智能家居通过语音实现人机交互,可以调动电器、控制门窗、调节灯光,这就是智能家居的生活奥秘。
在智慧终端的生产过程中,圭角不露的电子胶粘剂大有作为。
Ancham电子密封胶、电子灌封胶、电子三防胶、电子导热胶等产品可进行结构粘接、防水与密封,为制造商提供更加优质耐用的胶粘产品应用方案。
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针对智能门锁的胶粘应用需求,Ancham提供结构粘接、防水与密封产品,为制造商提供更加轻质耐用的胶粘产品应用方案。
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Relying on leading solutions, we can manufacture "reliable + durable" innovative products, explore the problems of accelerating the efficiency and benefits of adhesive application in electronic manufacturing industry, and help build a new future of adhesive industry.
The Internet of things makes traditional furniture smarter. The smart home box realizes human-computer interaction through voice. With a password, you can mobilize appliances, control doors and windows, and adjust lights. This is the mystery of smart home life. In the production process of all smart terminals, the undisclosed electronic adhesive plays a great role.
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Due to the difference of regional climate conditions and the service environment of door locks, water vapor protection and mechanical impact resistance are important considerations for manufacturers to select adhesives.
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依托行业领先的手机/平板/无线充电解决方案,实现“可靠+耐用”的创新应用组合,同时探索加快电子制造行业的应用效率和效益问题,助力构建电子材料行业的新未来。
Ancham 电子胶粘剂可以满足屏幕盖板粘接和密封、PCB三防涂敷、扬声器及摄像头固定、传感器固定等需求。
Ancham PUR热熔胶、聚氨酯三防胶、RTV硅胶、丙烯酸UV胶为手机/平板/无线充电提供灵活的产品选型和定制策略,为电路的防护、长久的使用寿命、高效的生产以及创新设计提供更多选择。
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消费电子领域的磁吸式无线充电器由面板、磁环、线圈、感应线圈、屏蔽环、屏蔽罩、PCB、外壳等核心部件构成。其中面板与外壳之间以PUR热熔胶进行固定,线圈部位通过单组分室温固化硅橡胶固定,可提供稳固固定的同时,实现轻量化设计的可能。
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Relying on leading solutions, we can manufacture "reliable + durable" innovative products, explore the problems of accelerating the efficiency and benefits of adhesive application in electronic manufacturing industry, and help build a new future of adhesive industry.
Ancham adhesive can meet the needs of screen cover plate bonding and sealing, PCB three prevention coating, speaker and camera fixing, sensor fixing, etc.
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The panel and shell are fixed with pur hot melt adhesive, and the coil part is fixed with one component room temperature curing silicone, which can provide the possibility of stable fixation and lightweight design.
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Ancham为不同应用需求提供灵活的产品选型和定制策略,能够有效保护核心电路PCB,固定关键器件,延长使用寿命,提高生产效率,为扫地机器人的创新设计提供更多可能。
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Ancham provides flexible product selection and customization strategies for different application needs, which can effectively protect PCB, fix key components, prolong service life, improve production efficiency, and provide more possibilities for innovative design of sweeping robot.
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针对不同应用需求,Ancham提供灵活的产品选型和定制策略,为智能音箱屏幕盖板的粘接和密封、PCB三防涂敷、扬声器固定、结构件固定等提供完善的胶粘剂应用解决方案。
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Ancham provides perfect adhesive application solutions for screen cover plate bonding and sealing, PCB three prevention coating, speaker fixation, structural member fixation, etc.
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智能手机的胶粘应用取决于产品方案设计和整机制造两个环节,衍生出方案商指定和生产商决定两种模式。Ancham倡导客户全流程参与的服务机制,我们在整个产品开发过程中为您提供支持,以找到最适合您需求的胶粘剂解决方案。
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The adhesive application of smart phones depends on two links: product scheme design and machine manufacturing. Two modes are derived, namely, the designation of the solution provider and the decision of the manufacturer. Ancham advocates the service mechanism of customer participation in the whole process. We provide support for you in the whole product development process to find the adhesive solution that best suits your needs.
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平板电脑与电纸书在生过程产中存在较多重合工序,胶粘材料的应用集中于整机装配过程,如屏幕面板、结构粘接、缓冲、密封,以及手写笔的粘接等。
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平板电脑与电纸书在生过程产中存在较多重合工序,胶粘材料的应用集中于整机装配过程,如屏幕面板、结构粘接、缓冲、密封,以及手写笔的粘接等。
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Ancham提供灵活的产品选型和定制策略,为VR设备的结构设计提供胶粘材料支持,在保障长久舒适使用的同时,以简单易用的产品提升制造效率,为VR设备的创新设计提供更多选择。
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Ancham提供灵活的产品选型和定制策略,为VR设备的结构设计提供胶粘材料支持,在保障长久舒适使用的同时,以简单易用的产品提升制造效率,为VR设备的创新设计提供更多选择。
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聚氨酯导热胶粘剂,具有良好的导热和阻燃性能,固化后收缩率低,抗机械振动,耐冷热冲击、耐高温高湿环境性能出色。能有效粘合复合材料、金属、木材、塑料和橡胶、陶瓷和玻璃(可能需要底涂保持耐久性)等基材。
■ 适合有导热和阻燃要求的结构粘接应用。 ■ 动力电池电芯,模组和冷板的结构粘接。 ■ 光伏组件边框、双玻结构粘接,储能电池、逆变器设备的结构性应用。
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Polyurethane insulation potting compound, heated for fast curing. Excellent chemical resistance, excellent flexibility at low temperatures, protection of stress-sensitive electronic components, excellent adhesion to plastics, metals and glass, low and stable dielectric constant.
■ Sealing of automotive sensors, body electronic ECUs, and automotive electronic device components. ■ Potting of antennas and signal transceivers of communication equipment. ■ Protection of stress-sensitive chips or magnetic components in consumer electronic appliances.
Product Model | Color | Mixing Ratio | Viscosity | Operation Time | Tensile Strength | Dielectric Strength | Temperature | More Parameters |
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AP83(35) | Black | 100:16 | 1100±300 25℃ | 30~40min 25℃ | 4.5MPa | >20kV/mm | -55~130℃ | Detailed introduction |
AP83(55) | Black | 100:16 | 1100±300 25℃ | 30~40min 25℃ | 7.5MPa | >20kV/mm | -40~130℃ | Detailed introduction |
对单双目和环视摄像头,安川产品在粘接、密封、保护与热管理方面提供可靠、便捷的解决方案,让多个传感器的协同工作变得更加灵活可靠。
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是一种基于改性硅烷的单组分粘接密封胶,通过与湿气反应,固化形成弹性胶体。固化后粘接强度高,耐高低温及耐候性能优异。
对通用塑料、玻璃、金属、混凝土和陶瓷等绝大多数基材具有良好的附着力,适用于较大面积的结构粘接或密封应用。
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持续的应用探索,让安川在高性能胶粘剂的创新研发方面积累了丰富的经验,从电路板级的披覆保护,到电性能管理和热管理,Ancham品牌借助现有及正在开发的产品和技术,帮助ADAS驾驶辅助传感器建立安全、可靠的应用体验。
源于我们安全和易用的技术初衷,安川为ADAS高级辅助驾驶系统提供灵活、全面的产品组合。对单双目和环视摄像头、毫米波和激光雷达,安川产品在粘接、密封、保护与热管理方面提供可靠、便捷的解决方案,让多个传感器的协同工作变得更加灵活可靠。
安川已经与全球多个一线品牌建立合作关系,与客户共同参与产品开发,从客户端的产品设计阶段开始,始终关注产品应用的各项需求,提供值得信赖的胶粘剂产品和技术支持。
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有机硅、环氧树脂、丙烯酸酯和聚氨酯的创新组合解决方案,灵活定制产品性能和施胶工艺,为客户每一个创新的设计和组装,提供解决办法。协同配合客户的开发和实施环节,帮助太阳能实现降本增效,共同助力行业进步。光伏的未来至关重要。
科技的突破和发展,使得能源转换的效率跃升,清洁、安全和可再生的太阳能是实现可持续发展最合理的路径。着眼于光伏和储能市场,安川以专注专研的精神推动该领域的产品技术研究,利用高分子复合材料方面的技术和经验,安川开发出高性能、高效应用的胶粘剂产品组合,助力更低成本、更高效率的光伏和储能技术发展。
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依托行业领先的智能硬件解决方案,实现“可靠+耐用”的创新应用组合,同时探索加快电子制造行业的应用效率和效益问题,助力构建电子材料行业的新未来。
随着科技的发展智能硬件的功能越来越多,形态也越来越多样化。胶粘剂的特殊性能帮助智能硬件实现一些复杂结构的粘合,从组装和硬件设备的维护过程中均发挥着重要的作用。
为智能硬件厂商的创新研发,提供强有力的支持。
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源于我们安全和易用的技术初衷,安川为车载雷达提供灵活、全面的产品组合。
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着眼于光伏市场,安川以专注专研的精神推动该领域的产品技术研究,利用高分子复合材料方面的技术和经验,安川开发出高性能、高效应用的胶粘剂产品组合,助力更低成本、更高效率的光伏技术发展。
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着眼于储能市场,安川以专注专研的精神推动该领域的产品技术研究,利用高分子复合材料方面的技术和经验,安川开发出高性能、高效应用的胶粘剂产品组合,助力更低成本、更高效率的储能技术发展。
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可剥胶是一种可剥离乳胶膜产品,针对基材表面处理工艺中的临时保护应用而开发。固化速度快,具有较强的耐水、耐油、耐腐蚀性和绝缘性。 可剥胶喷涂在物体表面后,即形成一层可剥薄膜,通过膜对物体的有效隔离,能够吸冲缓振,屏障污染,达到防脏、防锈、防酸碱、防擦伤及一撕即新的理想状态。
适用于表面处理工艺中临时遮蔽和保护应用。
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It is a single component adhesive sealant based on modified silane, which reacts with moisture and solidifies to form an elastic colloid. After curing, the adhesive strength is high, with excellent resistance to high and low temperatures and weather resistance.
It has good adhesion to most substrates such as general plastics, glass, metals, concrete, and ceramics, and is suitable for large-area structural bonding or sealing applications.
Product Model | Color | Viscosity | Hardness | Condition | Volume Resistivity | Temperature | More Parameters |
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AS3101 | Black/White | 5000~10000 25℃ | 65±5A | 168h 25℃/60%RH | 3.56×10^13Ω.cm | -40~90℃ | Detailed introduction |
Product Model | Color | Viscosity | Proportion | Condition | More Parameters |
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PM7005 | Cream white to yellowish | 20000±5000 25℃ | 1.09~1.17g/cm³ 25℃ | 5~10min 25℃ |
Detailed introduction |
Peelable mask is a type of peelable latex film product developed for temporary protective applications in substrate surface treatment processes. Fast curing speed, with strong water resistance, oil resistance, corrosion resistance, and insulation properties. After spraying peelable adhesive on the surface of an object, a peelable film is formed. Through the effective isolation of the film from the object, it can absorb impact and slow vibration, barrier pollution, and achieve the ideal state of dirt prevention, rust prevention, acid and alkali resistance, scratch resistance, and one tear is new.
Suitable for temporary shielding and protection applications in surface treatment processes.
Product Model | Color | Viscosity | Proportion | Condition | More Parameters |
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PM7005 | Cream white to yellowish | 20000±5000 25℃ | 1.09~1.17g/cm³ 25℃ | 5~10min 25℃ |
Detailed introduction |
Innovative combination solutions of silicone, epoxy, acrylate and polyurethane with flexible customization of product performance and sizing process provide solutions for every innovative design and assembly of customers.
Contributing to innovation and breakthroughs in photovoltaic & energy storage technologies Focusing on the photovoltaic and energy storage market, Ancham utilizes its technology and experience in polymer composite materials to develop a portfolio of high-performance and high-efficiency adhesive products to help the development of lower-cost and higher-efficiency photovoltaic and energy storage technologies.
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Based on our original intention of safety and ease of use technology, Ancham provides a flexible and comprehensive product portfolio for in car radars.
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For monocular and panoramic cameras, Ancham products provide reliable and convenient solutions in bonding, sealing, protection, and thermal management, making the collaborative work of multiple sensors more flexible and reliable.
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Focusing on the energy storage market, Ancham promotes product technology research in this field with a focus on specialized research. By utilizing the technology and experience in polymer composite materials, Ancham has developed a high-performance and efficient adhesive product portfolio to assist in the development of lower cost and more efficient energy storage technology.
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Focusing on the photovoltaic market, Ancham promotes product technology research in this field with a focus on specialized research. By utilizing the technology and experience in polymer composite materials, Ancham has developed a high-performance and efficient adhesive product portfolio to assist in the development of lower cost and more efficient photovoltaic technology.
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经紫外线/或足够强度的可见光的照射可快速固化,也可与厌氧型胶粘剂促进剂反应固化。固化时形成强键,固化后形成柔韧透明的胶层,耐冲击和振动,应用温度范围广,并具有优良的抗湿气性能。
主要用于LCD 封口,还可用于玻璃、金属粘接,电气元件封装,电线粘接。
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It can be quickly cured by exposure to ultraviolet light or sufficient intensity of visible light, and can also react with anaerobic adhesive promoters for curing. During curing, strong bonds are formed, and after curing, a flexible and transparent adhesive layer is formed, which is resistant to impact and vibration, has a wide range of application temperatures, and has excellent moisture resistance.
Mainly used for LCD sealing, it can also be used for glass and metal bonding, electrical component packaging, and wire bonding.
Product Model | Color | Viscosity | Hardness | Condition | Lap Shear Strength | More Parameters |
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AC5120 | Transparent | 20000 25℃ | 65±5D | 30mW/cm² | 11MPa PC/PC |
Detailed introduction |
The UV light and moisture dual curing system has high thixotropy, is not easy to flow after gluing, and has good adhesive flexibility.
Widely suitable for bonding transparent plastics such as PC, PVC, ABS and other materials, especially for packaging electronic components and chip corner reinforcement. It can also be used for bonding plastics to metals, plastics to glass, and supports fluorescence detection after bonding.
Product Model | Color | Viscosity | Hardness | Condition | Lap Shear Strength | More Parameters |
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AC5615F | Clear yellowish/Red/Blue (fluorescent) | 15000±2000 25℃ | 68±5D | 2000mJ/cm² | ≥18MPa PC/PC |
Detailed introduction |
UV光和湿气双重固化体系,具有高触变性,施胶后不易流动,粘接柔韧性佳。
广泛适用于透明塑料如PC、PVC、ABS等材质粘接,尤其适用于电子元件的包封及芯片边角补强,也可用于塑料与金属、塑料与玻璃的粘接,粘接后支持荧光检测。
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UV光和湿气双重固化,湿气二次固化可加强产品粘接性能。对于精密风扇马达的动平衡校准有平衡嵌补的作用,同时可承受电机马达长时间振动带来的机械冲击。
对大多数金属和塑料基材都有优异粘接性能。
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UV light and moisture dual curing, moisture secondary curing can enhance product adhesion performance. UV light and moisture dual curing, moisture secondary curing can enhance product adhesion performance. For the dynamic balance calibration of precision fan motors, it has the function of balancing interpolation, and can withstand the mechanical impact caused by long-term vibration of the motor.
Excellent adhesion performance for most metal and plastic substrates.
Product Model | Color | Viscosity | Hardness | Condition | Lap Shear Strength | More Parameters |
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AC5602 | White | 25000±5000 25℃ | 70±5D | 2000~5000mJ/cm² | 7~9MPa PC/PC |
Detailed introduction |
工业电机和非工业电机在结构组成上,通常有相似性,这些部件虽然可能在不同类型的电机中有所差异,但它们在各自电机中的作用和功能是类似的。胶粘剂在电机生产过程中的应用,集中体现于零部件及总成的组装生产环节,胶粘剂所起到的作用,主要体现在结构粘接、端盖密封装配、控制模块的密封及热管理。
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Industrial motors and non industrial motors usually have similarities in structural composition, and although these components may differ in different types of motors, their roles and functions in their respective motors are similar. The application of adhesives in the production process of motors is mainly reflected in the assembly and production of components and assemblies. The role of adhesives is mainly reflected in structural bonding, end cap sealing assembly, control module sealing, and thermal management.
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