The UV light and moisture dual curing system has high thixotropy, is not easy to flow after gluing, and has good adhesive flexibility.
Widely suitable for bonding transparent plastics such as PC, PVC, ABS and other materials, especially for packaging electronic components and chip corner reinforcement. It can also be used for bonding plastics to metals, plastics to glass, and supports fluorescence detection after bonding.
Product Model | Color | Viscosity | Hardness | Condition | Lap Shear Strength | More Parameters |
---|---|---|---|---|---|---|
AC5615F | Clear yellowish/Red/Blue (fluorescent) | 15000±2000 25℃ | 68±5D | 2000mJ/cm² | ≥18MPa PC/PC |
Detailed introduction |