Room temperature curing or fast curing at high temperature. Good flexibility, resistance to mechanical vibration, high bonding strength, excellent resistance to cold, high temperature and high humidity. Can effectively bond composite materials, metal, wood, plastic, rubber, ceramics and glass.
■ Suitable for bonding and sealing applications of various materials. ■ Photovoltaic cell frame, double-glass structure bonding, energy storage batteries, inverter equipment, structural applications.
Product Model | Color | Mixing Ratio | Viscosity | Hardness | Operation Time | Fracture Elongation | Lap Shear Strength | More Parameters |
---|---|---|---|---|---|---|---|---|
AP8145 | Black | 1:1 | 35000±10000 25℃ | 45~55D | 20min 5g @ 25℃ | ≥100% | 14MPa PC/PC |
Detailed introduction |
AP8145K | Black | 1:1 | 45000±10000 25℃ | 45~55D | 5~8min 5g @ 25℃ | ≥100% | 10MPa PC/PC |
Detailed introduction |