Ancham technology of adhesives helps our customers meet some of the more complex challenges

Two-component silicone thermally conductive gap filler that cures to a flexible elastomer at room or elevated temperatures and is used as a heat transfer medium for cooling electronic devices. This product does not produce stress on the components, for the heat source and its surrounding heat sinks, motherboards, metal shells and shells of the heat conduction.

■ Thermal conductivity 4.0W/m-K.
■ Low stress, protect electronic components.
■ Superior high and low temperature resistance.
■ UL94-V0, RoHS compliant.