Ancham technology of adhesives helps our customers meet some of the more complex challenges

AS42 (00) is a two-component, high thermal conductivity, flexible potting adhesive product with 100% solid content elastomer. It can cure at room temperature and accelerate its curing speed when heated. Medium low viscosity, high electrical insulation performance, low stress application, good temperature and weather resistance. Provides flame retardant, insulation, thermal conductivity, low modulus, and sealing performance. Can achieve automated production, designed specifically for electronic sealing, to meet ultra-low stress and high heat conduction needs.

■ Thermal conductivity: 2.5W/m·K.
■ Low contact thermal resistance.
■ 100% solid, no exudate after curing.
■ Low stress provides more effective protection for electronic components and chips.
■ Excellent environmental aging resistance and high and low temperature resistance.
■ Flame retardancy meets UL94-V0.
■ Compliant with ROHS and Reach, halogen-free.