High-performance one-component silicone sealant, moisture curing, good flexibility of the adhesive layer, good cohesion, suitable for adhesive sealing of materials with different coefficients of thermal expansion.AS3465/AS3465B is a thixotropic paste, resistant to sagging, can be used for FIPG sealing process. It has excellent high and low temperature resistance and excellent electrical properties.
■ Thixotropic. ■ Excellent flexibility. ■ Excellent high and low temperature resistance. ■ Solvent-free, RoHS, REACH compliant, halogen-free.
Product Model | AS3465/AS3465B |
Color | White/Black |
Paste | |
38±3A | |
5~20min 25℃/60%RH |
|
≥600% | |
-50~200℃ | |
2MPa(PC) 2.5MPa(Aluminium) |