Ancham technology of adhesives helps our customers meet some of the more complex challenges

High thermal conductivity one-component epoxy adhesive, no mixing, curing at high temperature, can be cured into a tough and strong structural bonding, with excellent impact resistance, mechanical and electrical properties, able to resist a variety of solvents and chemicals.

■ Thermal conductivity 5.0W/m·K.
■ Thixotropic paste.
■ Fast curing.
■ Resistant to mechanical shock.
■ High temperature and aging resistance.
■ Excellent water and solvent resistance.
■ RoHS and REACH compliant, halogen free.