Ancham technology of adhesives helps our customers meet some of the more complex challenges

One-component epoxy adhesive, high thixotropic, anti-sagging flow. 80℃ low temperature fast curing, good flexibility, high bonding strength. Used for metal, ceramics, glass, plastic material bonding.

■ Low temperature fast curing.
■ Good flexibility.
■ High bonding strength.
■ High thixotropy, anti-sagging.
■ Excellent electrical insulation properties.
■ High temperature and humidity resistance.
■ RoHS compliant, halogen free.