AS42(20) is a thermally conductive silicone potting compound that can be vulcanized at room temperature or under heating conditions. In addition to excellent thermal conductivity, this product also has characteristics such as low stress and excellent insulation performance, making it very suitable as a packaging and protection material for precision electronic products. Before curing, AS42(20) has good fluidity and leveling properties, and after curing, there will be no peeling phenomenon due to alternating use of cold and hot. The sealing surface is smooth and there is no volatiles generated.
■ Thermal conductivity 2.0W/m·K. ■ 100% solid, no exudate after curing. ■ Low stress provides more effective protection for electronic components and chips. ■ Excellent environmental aging resistance and high and low temperature resistance. ■ Flame retardancy meets UL94-V0. ■ Compliant with RoHS, REACH, halogen-free.
Product Model | AS42(20) |
Color | Light gray |
1:1 | |
9500±1000 25℃ |
|
45±5A | |
4~6h Initial Curing Time 24h Complete Curing Time |
|
-50~200℃ | |
2.0W/m·K |