Ancham technology of adhesives helps our customers meet some of the more complex challenges

One-componentt epoxy resin adhesive that quickly cures at a low temperature of 70℃ without damaging heat-resistant precision electronic components. It has excellent adhesion performance to most metal and plastic substrates.
AE1101 has good storage stability and longer dispensing operation time, which can meet the needs of efficient production.

■ Low temperature fast curing.
■ High bonding strength.
■ High and low temperature resistance, suitable for SMT reflow soldering/wave soldering process.
■ Excellent iMPact resistance and aging resistance.
■ Excellent electrical insulation performance.