Ancham technology of adhesives helps our customers meet some of the more complex challenges

AS32 (25) is a one-component neutral dealcoholized silicone adhesive that solidifies with moisture in air at room temperature, forming an elastic colloid with strong structural bonds after curing. This product has a high thermal conductivity of 2.7W/m·K and thixotropy, making it suitable for manual or automatic gluing processes. There will be no collapse or sagging during the gluing process. Without the use of primer, it has certain adhesion to substrates such as metals, engineering plastics, ceramics, and glass, is non corrosive, has good electrical insulation performance, and is suitable for structural bonding or sealing applications with high heat dissipation requirements.

■ Thermal conductivity coefficient is 2.7W/m·K. 
■ It has thixotropy. 
■ Non corrosive to metals. 
■ Short drying time and low odor during the curing process. 
■ It has excellent adhesion to most substrates. 
■ Excellent resistance to high and low temperatures. 
■  Excellent mechanical and chemical stability. 
■ Compliant with RoHS and Reach.